Silicone potting adhesive
JS-1184 addition molded silicone sealant for electronic appliances is mainly used for sealing various automotive electronics, power supplies, household electronics, and industrial electronic appliances. It mainly plays a role in waterproofing, heat conduction, flame retardancy, and collision prevention.
Product features
1. Good flow ability and small gap filling ability.
2. Excellent electrical insulation performance.
3. Good thermal conductivity.
4. Flame retardant grade: V-0
5. After curing, the product has small shrinkage, certain elasticity, and good vibration and impact resistance.
6. The product is suitable for mechanical sealing.
| Lnspection items |
JS-1184 0.45W |
JS-1184 0.8W |
JS-1184 1.0W |
JS-1184 1.5W |
Test method | |
|
Appearance |
A white B gray |
A white B gray |
A white B gray |
A white B gray |
Visualization | |
| Viscosity |
A |
1800±500 mPa·s |
3000~5000 mPa·s |
3000±1000 mPa·s |
2000±1000 mPa·s |
GB/T 2794 |
|
B |
1800±500 mPa·s |
3000~5000 mPa·s |
3000±1000 mPa·s |
3000±1000 mPa·s |
||
| Mixing ratio |
1:1 |
1:1 |
1:1 |
1:1 |
/ |
|
|
Operable time |
≥30min（25℃） |
≥30min（25℃） |
≥30min（25℃） |
≥30min （25℃） |
GB/T 7123.1-2015 |
|
| Density after curing |
1.3±0.05 g/cm3 |
1.7±0.1 g/cm3 |
1.8±0.1 g/cm3 |
2.6±0.1 g/cm3 |
GB/T 13477-2002 |
|
| Hardness after curing |
30~50A |
40~65A |
35~55A |
30~50A |
GB/T 531-2008 |
|
| Thermal conductivity |
0.45 W/(m·K) |
0.8 W/(m·K) |
1.0 W/(m·K) |
≥1.5 W/(m·K) |
ISO 22007-2 |
|
| Breakdown voltage |
≥15kV/mm |
≥15kV/mm |
≥15kV/mm |
≥15kV/mm |
GB/T 1695 |
|
| Volume resistivity |
≥1014Ω•cm |
≥1014Ω•cm |
≥1013Ω•cm |
≥1013Ω•cm |
GB/T 1692 |
|
|
Flame retardant grade |
V0 |
V0 |
V0 |
V0 |
UL94 |
|
- 1. Clean the dust, oil, etc. on the sealing surface before use.
- 2. Before mixing, first mix components A and B thoroughly in their respective containers.
- 3. When mixing, the weight ratio of component A: component B=1:1 should be followed.
- 4. Mixing component A and component B can be done manually or mechanically, stirring evenly. High speed and prolonged stirring should be avoided to prevent the shortening of operation time and accelerate solidification.
- 5. Vacuum defoaming can be carried out as needed.
- matters needing attention
- 1. The adhesive should be stored in a sealed manner, and the mixed adhesive should be used up at once to avoid waste.
- 2. This product belongs to non hazardous materials, but do not enter or eyes.
- 3. After long-term storage, the filler in the adhesive may settle. Please stir evenly before use, as it will not affect the performance.
- 4. The contact of the adhesive with the following chemical substances will cause the adhesive to not solidify: N, P, S organic compounds; Sn, Pb, Hg, As plasma compounds; Containing alkynes and multi vinyl compounds.
- Hazard indications, safety recommendations, transportation rules
- 1. Wear protective gloves for long-term or repeated contact.
- 2. Keep away from ignition sources, sparks, and open flames, keep the container sealed, and use explosion-proof electrical, ventilation, and lighting equipment.
- 3. This product belongs to non hazardous materials and can be transported as non hazardous materials.
This product is packaged in 25kg plastic drums
This product should be stored in a cool and dry place for a storage period of 6 months.